Endress Hauser Minicap FTC262-AA14I1 Détection du niveau du point de capacité OEM

Potentiel d'oxydation-réduction
January 08, 2025
Brief: Découvrez le Minicap FTC262-AA14I1 d'Endress Hauser, une solution économique de détection de niveau ponctuel capacitive pour les solides en vrac. Idéal pour les milieux agressifs et les accumulations importantes, ce dispositif OEM garantit des performances fiables dans des applications telles que les produits céréaliers, la farine et le ciment. Apprenez-en davantage sur ses caractéristiques, ses avantages et ses spécifications dans cet aperçu détaillé.
Related Product Features:
  • Designed for point level detection of light bulk solids with a grain size up to 30mm and dielectric constant εr ≥ 1.6.
  • Features an aluminium housing for durability and resistance to aggressive media.
  • Equipped with PNP transistor output for seamless communication.
  • Operates in a wide temperature range from -40°C to +80°C (-40°F to +176°F).
  • Handles process pressure from -1 to +6 bar (-14.5 to +90 psi).
  • Sensor length options range from 500mm (20") to 6,000mm (236").
  • Includes active build-up compensation for high operational safety and reliability.
  • Simple mounting and commissioning without calibration, ensuring cost-efficiency and long operating life.
Les questions:
  • What types of materials is the Minicap FTC262-AA14I1 suitable for?
    The Minicap FTC262-AA14I1 is ideal for light bulk solids such as grain products, flour, milk powder, animal feed, cement, chalk, or gypsum, with a grain size up to 30mm and a dielectric constant εr ≥ 1.6.
  • What are the temperature and pressure limits of this device?
    The device operates within a temperature range of -40°C to +80°C (-40°F to +176°F) and can handle process pressures from -1 to +6 bar (-14.5 to +90 psi).
  • How does the Minicap FTC262-AA14I1 ensure operational safety?
    The Minicap FTC262-AA14I1 features active build-up compensation, which enhances operational safety and reliability by preventing false readings due to material build-up on the sensor.